Signal Integrity Engineer

NewPhotonics is a fabless semiconductor engineering innovative optical-first silicon photonic product and technology for AI interconnect in data centers and hyperscaler infrastructure. Our market-disrupting PIC solutions enable energy efficiency, production simplicity and volume manufacturing of pluggable, NPO and CPO chips and engine platforms that will compact-packaged optical connectivity in scale-out, scale-up and scale-across networks. Job Description We are looking for a Signal Integrity Engineer to join our team, responsible for ensuring high-speed signal quality, optimization of complex PCB layouts, and advanced electromagnetic simulations for next-generation electro-optical systems. Main Responsibilities Perform advanced electromagnetic (EM), Signal Integrity (SI), and Power Integrity (PI) simulations for high-speed boards and packages supporting speeds up to 224 Gbps. Collaborate closely with the Hardware Board Design team to define layout guidelines, stackups, and routing constraints for ultra-high-speed interfaces. Analyze S-parameters, eye diagrams, insertion loss, return loss, and frequency-domain models to mitigate crosstalk and signal degradation. Validate simulation models against lab measurements using high-speed oscilloscopes, VNAs, and TDR equipment. Define and optimize high-speed transmission lines, differential pairs, vias, and connector transitions. B.Sc. or M.Sc. in Electrical Engineering. 5+ years of experience specializing in High-Speed Signal Integrity and Power Integrity engineering. Proven hands-on expertise with industry-standard simulation tools such as ANSYS HFSS, SIwave, PowerSI, or Keysight ADS. Deep theoretical and practical knowledge of transmission line theory, electromagnetic fields, S-parameters, and jitter analysis. Experience with high-speed serial links (e.g., PCIe, Ethernet, SerDes) operating at tens of Gbps. Strong correlation skills between simulation results and physical laboratory measurements. Star Candidate Advantages Experience with advanced packaging technologies, silicon photonics interfaces, and optical transceivers SI analysis. Background in scripting (Python/MATLAB) for automating SI workflows and post-processing simulation data. Familiarity with mSAP and high-density HDI manufacturing constraints.