Package Design/Technology/Layout Engineer
- Haifa, Israel
- עמוד קריירה של החברה
- נבדק לאחרונה
תיאור
Minimum qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 1 year of experience with semiconductor package design and substrate layout. Experience with industry-standard packaging EDA tools such as Cadence APD/APD+, Cadence Allegro, or Siemens/Mentor Xpedition.